SURFACE STACK™ Solderless Connectors

Teledyne Interconnect Devices' Surface Stack™ connectors are designed to provide solderless, one-piece surface-mount solutions for stacking printed circuit boards Through use of unique "pressure contacts", the connectors are able to eliminate the need for plated thru holes and costly soldering operations. In order to provide a wide range of interconnection solutions, Teledyne Interconnect Devices offers two distinct lines of Surface Stack™ connectors, the Surface Stack™ TKC™ and BECON™ lines. Both product lines meet applicable military specifications.

Surface Stack™ TKC™ connectors have been developed specifically for use in applications subject to high levels of vibration and shock. To assure reliable and continuous contact under such conditions, Teledyne Interconnect Devices' engineers developed the Cone Point™ contact (shown in Figures 1 and 2). A cone-shaped protrusion rounded on the truncated end of the contact, the Cone Point™ provides high-pressure connection interface. The Cone Point™ is available on both gold-and tin-plated versions of the TKC™ connector. On tin-plated models the high point pressures generated by the Cone Point™ causes the solder to cold flow. This, in turn, causes a "socket" to form around the Cone Point™. In the process, oxide film separates from the surface of the tin, providing an oxide-free contact surface. A "gas-tight" interface is created. Insulators for Surface Stack™ TKC™ connectors are made of injection-molded, engineering plastics that meet UL flame-resistance standard 94V-O. Contact plating can be either tin or gold.