These high density, low-profile, one-piece board-stacking connectors are examples of the design and manufacturing capabilities of Teledyne Interconnect Devices. The two examples shown here were designed with a contact pitch of 1.0mm and 0.5mm, respectively, with both connectors having compression contacts on one side and SMT solder on the other. Connector designs such as these are ideal for applications in cell phones, "micro" disc drives, digital cameras and a variety of PDA's.

The dual-row connector (shown on the left) was designed with 16 contacts and a stacking height of approximately 2.3mm (0.091"). The other connector (shown on the right) was designed with 20 contacts and a stacking height of approximately 2.0mm (0.076").