Solderless connection to microprocessor, ASIC, and other large packages.
	Replaces ball grid array and pin type connectors.
	Optional SMT solder configuration is available for direct soldering to PCB.
	High performance. Short contact length yields low inductance at high frequencies.

• Contacts are gold plated beryllium copper. Contact are formed in a "C" shape.
• Spring stress is contained in the metal and not plastic.
• Low contact force. Contact force can be engineered to meet specific requirements.
• Contacts are all metal, rigidly supported in plastic matrix (LCP).
• Low Profile.
• Adaptable to many pad layouts. Arrays over 2000 contacts are practical.
• High density contact spacing. Current pitch is 1.27 mm, 1.12 mm & 1.00 mm.
• Competitive price.

• MicroConn® Performance Data
• MicroConn® Illustration
• MicroConn® Exploded View
• MicroConn® Brochure PDF