Problem 1
A major computer manufacturer needed to shrink package size on a lap-top computer. A primary obstacle was the size of the connector interconnecting .010" diameter magnet wire to the PCB. Connector height had to be minimal. Overall cost had to be very low.
Solution
Teledyne Interconnect Devices designed a low-profile connector only .043" thick. The connector cannot be damaged by misalignment during automated assembly.
Installation was solved as follows: the customer positioned the connector and then soldered the four magnet wires to the connector contacts. The PCB was placed into a recess and retained with self-tapping screws. The contacts pressed directly on the PCB's tin pads. The tin plating on the pads and the contacts cold flowed together to form a gas-tight seal.
Problem 2
A manufacturer of low-profile notebook computers needed to stack boards reliably at .050" pitch and .050" height. The connector had to combine surface mount technology with contacts soldered to the mother board. The mating board had to be compression surface-mount technology.
Solution
A low-profile connector was designed using a body .050" thick and having a height of .050". In addition, Teledyne Interconnect Devices' engineers designed in a network of locating nibs, which held the connector pressed flush with the mother board to allow precision IR reflow soldering of the contacts to the PCB.
Applications
This technology is ideal for virtually any application requiring compact, low-profile packaging. Please call Teledyne Interconnect Devices for further information.
