| Easy-Assembly Balanced-Pressure™ Connector
Problem
Design a connector that allows increased length and number of contacts, while providing significant cost savings through simplified installation and registration.
Solution
To solve the problem, Teledyne Interconnect Devices created a new member of the Surface Stack™ connector family... the Balanced-Pressure™ Stacking Connector. This solderless connector offers several unique, cost-saving features designed to speed installation and provide virtually automatic contact registration.
Special Features
- New mounting hole configuration eliminates need for stiffeners with balanced contact pressure.
- Mounting hole boss provides easy registration to PCB pad.
- Solderless mate to PCB pad.
Options
- Height: .250" to .1500"
- Spacing: .050" or .100"
- Contacts: Soldertails one side
- Plating: Tin or Gold
- Mounting: Thru-hole or threaded insert
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