| Applications
Surface Stack™ Designer's Guide
Teledyne Interconnect Devices' Surface Stack™ connectors are available in three basic orientations. These orientations include 180º double contact, 180º single-sided contact and 90º single-sided contact with solder tail. In addition to the standards, additional Surface Stack™ configurations include 90º double contact, PCB-to-wire and PCB-to-flex circuit. As a service to current and future Teledyne Interconnect Devices customers, we present here just a few of the many ways Surface Stack™ connectors can be incorporated into PC board designs.
Why Use Surface Stack™ Connectors
- Highly efficient, cost-effective connection solutions
- One-piece, solderless surface mounting
- Low contact resistance
- Low capacitance for reduced cross-talk
- Low profile for tight packaging
- Automatic contact-to-pad registration
- Elimination of plated thru holes
- Choice of tin or gold plated contacts
- Contact wiping action
- Proven reliability
- Gas tight seals...meets applicable mil specs
Applications
- Computers
- Medical instruments
- Disc drives
- Instrument clusters
- Data loggers
- Communication equipment
- Missiles
- Automotive
|
